{"product_id":"9780071737739","title":"Area Array Package Design","description":"This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.","brand":"McGraw-Hill Companies, The","offers":[{"title":"Default Title","offer_id":47022040613104,"sku":"9780071737739","price":149.95,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780071737739_p0.jpg?v=1763635888","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780071737739","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}