{"product_id":"9780071785150","title":"Through-Silicon Vias for 3D Integration","description":"A comprehensive guide to TSV and other enabling technologies for 3D integration  \u003cp\u003eWritten by an expert with more than 30 years of experience in the electronics industry, \u003ci\u003eThrough-Silicon Vias for 3D Integration\u003c\/i\u003e provides cutting-edge information on TSV, wafer thinning, thin-wafer handling, microbumping and assembly, and thermal management technologies. Applications to highperformance, high-density, low-power-consumption, wide-bandwidth, and small-form-factor electronic products are discussed.\u003c\/p\u003e  \u003cp\u003eThis book offers a timely summary of progress in all aspects of this fascinating field for professionals active in 3D integration research and development, those who wish to master 3D integration problem-solving methods, and anyone in need of a low-power, wide-bandwidth design and high-yield manufacturing process for interconnect systems.\u003c\/p\u003e  \u003cp\u003eCoverage includes:\u003c\/p\u003e  \u003cul\u003e \u003cli\u003eNanotechnology and 3D integration for the semiconductor industry\u003c\/li\u003e  \u003cli\u003eTSV etching, dielectric-, barrier-, and seed-layer deposition, Cu plating, CMP, and Cu revealing\u003c\/li\u003e  \u003cli\u003eTSVs: mechanical, thermal, and electrical behaviors\u003c\/li\u003e  \u003cli\u003eThin-wafer strength measurement\u003c\/li\u003e  \u003cli\u003eWafer thinning and thin-wafer handling\u003c\/li\u003e  \u003cli\u003eMicrobumping, assembly, and reliability\u003c\/li\u003e  \u003cli\u003eMicrobump electromigration\u003c\/li\u003e  \u003cli\u003eTransient liquid-phase bonding: C2C, C2W, and W2W\u003c\/li\u003e  \u003cli\u003e2.5D IC integration with interposers\u003c\/li\u003e  \u003cli\u003e3D IC integration with interposers\u003c\/li\u003e  \u003cli\u003eThermal management of 3D IC integration\u003c\/li\u003e  \u003cli\u003e3D IC packaging\u003c\/li\u003e  \u003c\/ul\u003e","brand":"McGraw-Hill Education","offers":[{"title":"Default Title","offer_id":47108045570288,"sku":"9780071785150","price":149.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780071785150_p0.jpg?v=1763635897","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780071785150","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}