{"product_id":"9780071848077","title":"3D IC Integration and Packaging","description":"\u003cb\u003eA comprehensive guide to 3D IC integration and packaging technology\u003c\/b\u003e\u003cbr\u003e \u003ci\u003e3D IC Integration and Packaging\u003c\/i\u003e fully explains the latest microelectronics techniques for increasing chip density and maximizing performance while reducing power consumption. Based on a course developed by its author, this practical guide offers real-world problem-solving methods and teaches the trade-offs inherent in making system-level decisions. Explore key enabling technologies such as TSV, thin-wafer strength measurement and handling, microsolder bumping, redistribution layers, interposers, wafer-to-wafer bonding, chip-to-wafer bonding, 3D IC and MEMS, LED, and complementary metal-oxide semiconductor image sensors integration. Assembly, thermal management, and reliability are covered in complete detail.\u003cbr\u003e \u003ci\u003e3D IC Integration and Packaging \u003c\/i\u003ecovers:\u003cbr\u003e • 3D integration for semiconductor IC packaging• Through-silicon vias modeling and testing• Stress sensors for thin-wafer handling and strength measurement• Package substrate technologies• Microbump fabrication, assembly, and reliability• 3D Si integration• 2.5D\/3D IC integration• 3D IC integration with passive interposer• Thermal management of 2.5D\/3D IC integration• Embedded 3D hybrid integration• 3D LED and IC integration• 3D MEMS and IC integration• 3D CMOS image sensors and IC integration• PoP, chip-to-chip interconnects, and embedded fan-out WLP","brand":"McGraw-Hill Education","offers":[{"title":"Default Title","offer_id":47119331819760,"sku":"9780071848077","price":180.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780071848077_p0.jpg?v=1763637725","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780071848077","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}