{"product_id":"9780387388908","title":"Solder Joint Technology: Materials, Properties, and Reliability","description":"\u003cp\u003eThe European Union’s directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.\u003c\/p\u003e\u003cp\u003e\u003c\/p\u003e","brand":"Springer New York","offers":[{"title":"Default Title","offer_id":47016433484016,"sku":"9780387388908","price":249.99,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780387388908_p0.jpg?v=1763695798","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780387388908","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}