{"product_id":"9780791801680","title":"Thermal Management of Microelectronic Equipment: Heat Transfer Theory, Analysis Methods and Design Practices","description":"\u003cp\u003eBy Lian-Tuu Yeh and Richard C. Chu\u003c\/p\u003e\u003cp\u003eWith an increased demand on system reliability and performance combined with the miniaturization of devices, thermal consideration has become a crucial factor in the design of electronic packaging, from chip to system levels.\u003c\/p\u003e\u003cp\u003eThis new book emphasizes the solving of practical design problems in a wide range of subjects related to various heat transfer technologies.\u003c\/p\u003e\u003cp\u003eWhile focusing on understanding the physics involved in the subject area, the authors have provided substantial practical design data and empirical correlations used in the analysis and design of equipment.\u003c\/p\u003e\u003cp\u003eThe book provides the fundamentals along with a step-by-step analysis approach to engineering, making it an indispensable reference volume.\u003c\/p\u003e\u003cp\u003eThe authors present a comprehensive convective heat transfer catalog that includes correlations of heat transfer for various physical configurations and thermal boundary conditions.\u003c\/p\u003e\u003cp\u003eThey also provide property tables of solids and fluids. Lian-Tuu Yeh and Richard Chu are recognized experts in the field of thermal management of electronic systems and have a combined 60 years of experience in the defense and commercial industries.  \u003c\/p\u003e","brand":"A S M E Press","offers":[{"title":"Default Title","offer_id":47020126470384,"sku":"9780791801680","price":102.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780791801680_p0.jpg?v=1763665956","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780791801680","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}