{"product_id":"9780857099112","title":"Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture","description":"\u003cp\u003e\u003ci\u003eRobust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture \u003c\/i\u003ediscusses how the reliability of packaging components is a prime concern to electronics manufacturers. \u003c\/p\u003e \u003cp\u003eThe text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. \u003c\/p\u003e \u003cp\u003eThe authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included.\u003c\/p\u003e\u003cul\u003e\n\u003cli\u003eDiscusses how the reliability of packaging components is a prime concern to electronics manufacturers\u003c\/li\u003e\n\u003cli\u003ePresents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques\u003c\/li\u003e\n\u003cli\u003eIncludes program files and macros for additional study\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"Elsevier Science","offers":[{"title":"Default Title","offer_id":47108137648368,"sku":"9780857099112","price":200.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9780857099112_p0.jpg?v=1763827762","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9780857099112","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}