{"product_id":"9781119046004","title":"SiP System-in-Package Design and Simulation: Mentor EE Flow Advanced Design Guide","description":"\u003cp\u003e\u003cb\u003eAn advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow\u003c\/b\u003e\u003c\/p\u003e \u003cp\u003eWritten by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. \u003c\/p\u003e \u003cp\u003eExtensively illustrated throughout, \u003ci\u003eSystem in Package Design and Simulation\u003c\/i\u003e covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including:  \u003c\/p\u003e \u003cul\u003e \u003cli\u003eCavity and sacked dies design\u003c\/li\u003e \u003cli\u003eFlipChip and RDL design\u003c\/li\u003e \u003cli\u003eRouting and coppering\u003c\/li\u003e \u003cli\u003e3D Real-Time DRC check\u003c\/li\u003e \u003cli\u003eSiP simulation technology\u003c\/li\u003e \u003cli\u003eMentor SiP Design and Simulation Platform\u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003eDesigned to function equally well as a reference, tutorial, and self-study, \u003ci\u003eSystem in Package Design and Simulation\u003c\/i\u003e is an indispensable working resource for every SiP designer, especially those who use Mentor design tools. \u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47118437417200,"sku":"9781119046004","price":121.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9781119046004_p0.jpg?v=1763696088","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781119046004","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}