{"product_id":"9781119966807","title":"Lead-free Solders: Materials Reliability for Electronics","description":"Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. \u003ci\u003eLead-free Solders: Materials Reliability for Electronics\u003c\/i\u003e chronicles the search for reliable drop-in lead-free alternatives and covers: \u003cul\u003e \u003cli\u003ePhase diagrams and alloy development \u003c\/li\u003e \u003cli\u003eEffect of minor alloying additions \u003c\/li\u003e \u003cli\u003eComposite approaches including nanoscale reinforcements \u003c\/li\u003e \u003cli\u003eMechanical issues affecting reliability \u003c\/li\u003e \u003cli\u003eReliability under impact loading \u003c\/li\u003e \u003cli\u003eThermomechanical fatigue \u003c\/li\u003e \u003cli\u003eChemical issues affecting reliability \u003c\/li\u003e \u003cli\u003eWhisker growth \u003c\/li\u003e \u003cli\u003eElectromigration \u003c\/li\u003e \u003cli\u003eThermomigration \u003c\/li\u003e \u003c\/ul\u003e \u003cp\u003ePresenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.\u003c\/p\u003e","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47136532660464,"sku":"9781119966807","price":206.95,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9781119966807_p0.jpg?v=1769890742","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781119966807","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}