{"product_id":"9781441976178","title":"3D Integration for NoC-based SoC Architectures","description":"This book presents the research challenges that are due to the introduction of the 3rd dimension in chips for researchers and covers the whole architectural design approach for 3D-SoCs. Nowadays the 3D-Integration technologies, 3D-Design techniques, and 3D-Architectures are emerging as interesting, truly hot, broad topics. The present book gathers the recent advances in the whole domain by renowned experts in the field to build a comprehensive and consistent book around the hot topics of three-dimensional architectures and micro-architectures. This book includes contributions from high level international teams working in this field.","brand":"Springer New York","offers":[{"title":"Default Title","offer_id":47059102007536,"sku":"9781441976178","price":179.99,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9781441976178_p0.jpg?v=1763796029","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781441976178","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}