{"product_id":"9781558995741","title":"Advanced Metallization Conference 2000 (AMC 2000): Volume 16","description":"\u003cp\u003eThis book focuses on recent work in on-chip interconnects and other aspects of advanced metallization. In particular, the concentration for this year's volume is on the rapid advances in copper and low-K. The volume is divided into nine parts: Part I contains an invited perspective on the state of semiconductor research and development in Japan; Part II focuses on performance aspects of interconnect architectures; Part III includes some of the most significant recent advances in copper\/low-K integration; Part IV is an in-depth collection of electrochemical and chemical processes, mainly pertaining to copper; Part V contains state-of-the-art papers on thin-film diffusion barriers, again mainly for copper wiring; Part VI covers reliability engineering and results; Part VII is a collection of alternative and novel processes and systems related to circuit interconnection; Part VIII contains papers on specific low-K dielectrics and their properties, and new methods for their characterization; and Part IX covers continuing advances in the Al(Cu)\/W metallization system.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Default Title","offer_id":47055773204720,"sku":"9781558995741","price":31.99,"currency_code":"USD","in_stock":false}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781558995741","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}