{"product_id":"9781558997196","title":"Advanced Metallization Conference 2002 (AMC 2002): Volume 18","description":"\u003cp\u003eLeading-edge metallization schemes inherently involve the introduction of novel metal systems and novel dielectric materials. Technological advances highlighted during AMC 2002 include the latest developments in integrating copper-based metallization with low-dielectric constant materials and in evaluating the reliability of such interconnects. For the second consecutive year, the volume takes a special look at the status of vertical integration, or 3D chips, and the promise it holds for high-density functional integration and heterogeneous integration. Technical leaders from around the world come together in this volume, the 18th in a popular series from the Materials Research Society, to offers a comprehensive overview of the current state of advanced metallization science and technologies. Topics include: advanced interconnects, 3D integration and packaging; CMP; reliability, test and characterization; metallization; integration; low-k\/dielectric materials and characterization; atomic layer deposition (ALD) and barriers.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Default Title","offer_id":47054677475568,"sku":"9781558997196","price":31.99,"currency_code":"USD","in_stock":false}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781558997196","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}