{"product_id":"9781558998650","title":"Advanced Metallization Conference 2005 (AMC 2005): Volume 21","description":"\u003cp\u003eTechnical leaders from around the world gather here to discuss developments in the areas of interconnect performance, advanced metallization, low-dielectric constant materials, barrier metallization, atomic layer deposition, advanced packaging and vertical integration. Both current state-of-the-art and ongoing challenges associated with multilevel interconnect are addressed. Included are papers on the latest developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the understanding of means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Additional contributions discuss the design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Default Title","offer_id":47049710567664,"sku":"9781558998650","price":31.99,"currency_code":"USD","in_stock":false}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781558998650","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}