{"product_id":"9781558999473","title":"Advanced Metallization Conference 2006 (AMC 2006): Volume 22","description":"\u003cp\u003eThe Advanced Metallization Conference 2006 - held in Tokyo and San Diego, California - highlights both current state-of-the-art and ongoing challenges associated with multilevel interconnects. Technical leaders from around the world gathered to discuss developments in the integration of low-dielectric constant materials with copper-based metallization, and advances in the means by which process- or stress-induced damage can be mitigated and reliability of the interconnect system improved. Contributions to the volume focus on design, development and modeling of advanced on-chip and multichip interconnect architectures and real-world implementation of optimized designs, materials and processes for production of leading-edge microelectronic devices. A keynote address by H.-S. Philip Wong, Stanford University, on 'Nanostructured Materials for Interconnects' is featured.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Default Title","offer_id":47054682915056,"sku":"9781558999473","price":104.0,"currency_code":"USD","in_stock":false}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781558999473","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}