{"product_id":"9781598292442","title":"Three-Dimensional Integration and Model","description":"\u003cp\u003eThis book presents a compact system-on-package (SOP)-based passive front-end solution for millimeter-wave wireless communication\/sensor applications, that consists of fully integrated three dimensional (3D) cavity filters\/duplexers and antenna. The presented concept is applied to the design, fabrication and testing of V-band transceiver front-end modules using multilayer low temperature co-fired (LTCC) technology. In this work, various compact and high-performance passive building blocks have been developed in both microstrip and cavity configurations and their integration, enabling a complete passives integration solution for 3D low-cost wireless millimeter-wave front-end modules. It is worthy to note that most of the designs implemented comes away with novel ideas and is presented as the first extensive state-of-art components, entirely validated by measured data at 60 GHz bands.\u003c\/p\u003e","brand":"Morgan \u0026 Claypool Publishers","offers":[{"title":"Default Title","offer_id":47036874621168,"sku":"9781598292442","price":40.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9781598292442_p0.jpg?v=1763810415","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781598292442","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}