{"product_id":"9781605111254","title":"Advanced Metallization Conference 2008 (AMC 2008): Volume 24","description":"\u003cp\u003eThe Advanced Metallization Conference - held in San Diego, California, and Tokyo, Japan - marked its 25th anniversary in 2008. These two sister conferences form a unique 'one conference at two sites' that focuses on the latest R\u0026amp;D and manufacturing results, as well as real-world integration and reliability data on the application of metallization and related technologies for advanced IC devices. Scientists and engineers from around the world came to listen and present state-of-the-art work in the field of ULSI interconnect technology including metallization, dielectrics, integration, packaging, design and vertical integration. A keynote address by Gary Patton, vice president, IBM Systems and Technology Group, on 'Leading-edge Silicon Technology through Innovation and Collaboration', is featured. Additional topics include: integration; metallization; materials and characterization; CMP and cleaning; 3D integration and packaging; low-k materials; and reliability and yield.\u003c\/p\u003e","brand":"Materials Research Society","offers":[{"title":"Default Title","offer_id":47052210274544,"sku":"9781605111254","price":108.0,"currency_code":"USD","in_stock":false}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9781605111254","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}