{"product_id":"9783527644230","title":"Handbook of Wafer Bonding","description":"The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. \u003cbr\u003e \u003cbr\u003e Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal\/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies.\u003cbr\u003e \u003cbr\u003e This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.","brand":"Wiley","offers":[{"title":"Default Title","offer_id":47177991028976,"sku":"9783527644230","price":217.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9783527644230_p0.jpg?v=1769888382","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9783527644230","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}