{"product_id":"9789077017036","title":"Thermal Challenges in Next Generation Electronic Systems - Proceedings of the THERMES 2002 Conference, Santa Fe, New Mexico, USA, January 13-16, 2002","description":"\u003cp\u003eThe editors present 44 papers that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures the papers are organized under the following categories: Challenges in micro- and nano-scale transport; Novel thermal management concepts; High heat flux transport; Transport in thermal management materials and across interfaces; Heat pipes and thermosyphons, Compact models; Design methodologies and Analysis and testing methods.\u003c\/p\u003e","brand":"IOS Press, Incorporated","offers":[{"title":"Default Title","offer_id":49788705997040,"sku":"9789077017036","price":203.0,"currency_code":"USD","in_stock":true}],"url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9789077017036","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}