{"product_id":"9789814508612","title":"Design And Modeling For 3d Ics And Interposers","description":"\u003cp\u003e3D Integration is being touted as the next semiconductor revolution. This book provides a comprehensive coverage on the design and modeling aspects of 3D integration, in particularly, focus on its electrical behavior. Looking from the perspective the Silicon Via (TSV) and Glass Via (TGV) technology, the book introduces 3DICs and Interposers as a technology, and presents its application in numerical modeling, signal integrity, power integrity and thermal integrity. The authors underscored the potential of this technology in design exchange formats and power distribution.\u003c\/p\u003e\u003cb\u003eContents:\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003eSystem Integration and Modeling Concepts\u003c\/li\u003e\n\u003cli\u003eModeling of Cylindrical Interconnections\u003c\/li\u003e\n\u003cli\u003eElectrical Modeling of Through Silicon Vias\u003c\/li\u003e\n\u003cli\u003eElectrical Performance and Signal Integrity\u003c\/li\u003e\n\u003cli\u003ePower Distribution, Return Path Discontinuities and Thermal Management\u003c\/li\u003e\n\u003cli\u003eAlternate Methods for Power Distribution\u003c\/li\u003e\n\u003c\/ul\u003e\u003cbr\u003e\u003cb\u003eReadership:\u003c\/b\u003e Graduate students, academics, researchers in electrical and electronics engineering, computer engineering, semiconductors and packaging.\u003cbr\u003e","brand":"World Scientific Publishing Company, Incorporated","offers":[{"title":"Default Title","offer_id":47185293312240,"sku":"9789814508612","price":51.0,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9789814508612_p0.jpg?v=1763691088","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9789814508612","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}