{"product_id":"9789814699037","title":"Advances in 3D Integrated Circuits and Systems","description":"\u003cp\u003e3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, \u003ci\u003eAdvances in 3D Integrated Circuits and Systems\u003c\/i\u003e, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.\u003c\/p\u003e\u003cp\u003eContents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I\/O management; and 3D designs of sensors, I\/Os, multi-core processors, and memory.\u003c\/p\u003e\u003cp\u003eAdvanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.\u003c\/p\u003e\u003cb\u003eContents:\u003c\/b\u003e\u003cul\u003e\n\u003cul\u003e\u003cli\u003eIntroduction\u003c\/li\u003e\u003c\/ul\u003e\n\u003cli\u003e\n\u003cb\u003e\u003ci\u003eDevice Modeling:\u003c\/i\u003e\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003eFabrication\u003c\/li\u003e\n\u003cli\u003eDevice Model\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cb\u003e\u003ci\u003ePhysical Design:\u003c\/i\u003e\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003eMacromodel\u003c\/li\u003e\n\u003cli\u003eTSV Allocation\u003c\/li\u003e\n\u003cli\u003eTesting\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cb\u003e\u003ci\u003eThermal Management:\u003c\/i\u003e\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003ePower and Thermal System Model\u003c\/li\u003e\n\u003cli\u003eMicrofluidic Based Cooling\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003cli\u003e\n\u003cb\u003e\u003ci\u003eI\/O Management:\u003c\/i\u003e\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003ePower I\/O Management\u003c\/li\u003e\n\u003cli\u003eSignal I\/O Management\u003c\/li\u003e\n\u003cli\u003eSensor\u003c\/li\u003e\n\u003cli\u003eI\/O\u003c\/li\u003e\n\u003cli\u003eMicroprocessor\u003c\/li\u003e\n\u003cli\u003eNon-volatile Memory\u003c\/li\u003e\n\u003c\/ul\u003e\n\u003c\/li\u003e\n\u003c\/ul\u003e\u003cbr\u003e\u003cb\u003eReadership:\u003c\/b\u003e Advanced undergraduates, graduate students, researchers and professionals dealing with 3D Integrated Circuits and Systems.\u003cbr\u003e\u003cb\u003eKey Features:\u003c\/b\u003e\u003cul\u003e\n\u003cli\u003eThis book that presents a comprehensive overview on the subject of 3D integrated circuits focusing on the design of circuits and systems\u003c\/li\u003e\n\u003cli\u003eThis book covers multiple topics about 3D integrated circuits, starting from fabrication, to modeling; then moving to system level power, thermal and I\/O management techniques; and finally, the design examples of emerging technologies\u003c\/li\u003e\n\u003c\/ul\u003e","brand":"World Scientific Publishing Company, Incorporated","offers":[{"title":"Default Title","offer_id":47119908274416,"sku":"9789814699037","price":27.99,"currency_code":"USD","in_stock":true}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0737\/7593\/9824\/files\/9789814699037_p0.jpg?v=1763692724","url":"https:\/\/shop-qa.barnesandnoble.com\/products\/9789814699037","provider":"Barnes \u0026 Noble (DEV)","version":"1.0","type":"link"}