1
/
of
1
Springer International Publishing
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Processes, Equipment, and Reliability
Regular price
$159.99 USD
Regular price
Sale price
$159.99 USD
Shipping calculated at checkout.
Quantity
Couldn't load pickup availability
Share
