Thermal Challenges in Next Generation Electronic Systems - Proceedings of the THERMES 2002 Conference, Santa Fe, New Mexico, USA, January 13-16, 2002

The editors present 44 papers that explore issues of thermal management in electronic products of a range of sizes, although the progression of shrinking system sizes is of particular concern. After the nine keynote and invited lectures the papers are organized under the following categories: Challenges in micro- and nano-scale transport; Novel thermal management concepts; High heat flux transport; Transport in thermal management materials and across interfaces; Heat pipes and thermosyphons, Compact models; Design methodologies and Analysis and testing methods.